Home›Search›Proceedings of International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory, DIPED

Proceedings of International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory, DIPED

IEEE Computer Society · United States

ISSN2165-3585

SJR -✓ Scopus / SJR

/ 100

High Risk

Score Breakdown

No verified metrics

Total0

Journal Impact Factor

Not on record at PubScope. The Journal Impact Factor is published by Clarivate for Web of Science (JCR)–indexed journals.

SJR Score

0.198

H-Index

⚡ Speed vs Prestige

How does this journal balance review speed with impact level?

SJR Rank

Bottom 25%

General Information

Country / RegionUnited States

Primary Language—

1st Year Published—

StatusActive

Total Publications—

Submission Info

Peer Review—

Review Time—

Acceptance Rate—

OA License—

OA Rate—

Ethics & Quality

COPE Member✗ No

OASPA Member✗ No

Not on Predatory Lists✓ Yes

Think.Check.Submit Compliance

thinkchecksubmit.org

4/12 · 33%

✅

Do you know the journal / publisher?

IEEE Computer Society

❌

Does the journal have a website?

No URL

✅

Is the ISSN verified?

2165-3585

✅

Indexed in a trusted database?

Scopus

❌

Peer review process documented?

N/A

❌

Follows ethical publishing standards (COPE)?

N/A

❌

APC fees clearly disclosed?

N/A

✅

Not on predatory/blacklists?

✓ Clean

❌

Long-term digital preservation?

N/A

❌

Plagiarism detection in place?

N/A

❌

Listed in DOAJ (verified OA)?

N/A

❌

Primary language documented?

N/A

Based on the Think.Check.Submit framework by DOAJ, COPE & OASPA. All data from verified open sources.

SJR Quartile by Discipline

Scimago ranks this journal separately in each subject category — its quartile can differ by discipline.

Acoustics and UltrasonicsUnranked

Electrical and Electronic EngineeringUnranked

Electronic, Optical and Magnetic MaterialsUnranked

Subject Classification

Scopus Categories

Electrical and Electronic EngineeringElectronic, Optical and Magnetic MaterialsAcoustics and Ultrasonics