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Journal of Electronic Packaging

American Society of Mechanical Engineers (ASME) · United States · Est. 1989

ISSN1528-9044

SJR Q2✓ WOS SCIE✓ Scopus / SJR

/ 100

High Trust

PubScope credibility score from verifiable indexing & ethics signals

Score Breakdown

◆ WoS flagship (SCIE/SSCI/AHCI)78

✓ Corroboration (3 more)+18

Total96

Level data: Norwegian Register (HK-dir), NLOD 2.0. · Third-party records · how this is calculated · Report an error →

⚡ Speed vs Prestige

How does this journal balance review speed with impact level?

Publication speed: not measurable

publisher doesn’t disclose per-article submission dates — we never estimate

SJR Rank

Top 50% in field

Impact Factor & Quartile · Web of Science (JCR)

✓ Indexed in the Web of Science Core Collection (SCIE) — Clarivate publishes an official Journal Impact Factor and JCR quartile for this journal.

See the official Impact Factor & quartile on the journal’s page ↗

The Impact Factor & JCR quartile are licensed by Clarivate — we link you to the official source instead of reprinting a number that can go out of date. Open metrics below: SCImago Q2. Source: Clarivate Journal Citation Reports.

SJR Scorei

0.497

H-Indexi

CiteScore

View ↗

Scopus metric · on the journal’s page

SNIPi

1.069

Total Worksi

2,280

Total Citationsi

44,908

2yr Mean Citednessi

1.59

Open Impact Factor alternative

Aims & Scope

Subject areas: Engineering, Electrical & Electronic; Engineering, Mechanical; Computer Science Applications; Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials; Mechanics of Materials.

General Information

Country / RegionUnited States

Primary LanguageEnglish

1st Year Published1989

FrequencyQuarterly

StatusActive (last: 2026)

Total Publications2,280

Publisher OrgASM International

Visit Journal Website

Submission Info

Peer Review—

Review Time—

Acceptance Rate—

OA License—

OA Rate—

Ethics & Quality

COPE Member✗ No

OASPA Member✗ No

Not on Predatory Lists✓ Yes

Think.Check.Submit Compliance

thinkchecksubmit.org

6/12 · 50%

✅

Do you know the journal / publisher?

American Society of Mechanical Engineers (ASME)

✅

Does the journal have a website?

✓ Linked

✅

Is the ISSN verified?

1528-9044

✅

Indexed in a trusted database?

WoS, Scopus, PubMed

❌

Peer review process documented?

N/A

❌

Follows ethical publishing standards (COPE)?

N/A

❌

APC fees clearly disclosed?

N/A

✅

Not on predatory/blacklists?

✓ Clean

❌

Long-term digital preservation?

N/A

❌

Plagiarism detection in place?

N/A

❌

Listed in DOAJ (verified OA)?

N/A

✅

Primary language documented?

English

Based on the Think.Check.Submit framework by DOAJ, COPE & OASPA. All data from verified open sources.

Publication & Citation Trend

Articles published

Citations received

2019

1.1k

2020

2021

363

2022

270

2023

202

2024

2025

2026

Source: OpenAlex · Each year’s green bar = citations earned by that year’s papers, counted to date — so recent years look lower simply because their papers haven’t had time to be cited yet.

SJR Quartile by Discipline

Scimago ranks this journal separately in each subject category — its quartile can differ by discipline.

Computer Science ApplicationsQ2

Electrical and Electronic EngineeringQ2

Electronic, Optical and Magnetic MaterialsQ2

Mechanics of MaterialsQ2

Subject Classification

Web of Science Categories

Engineering, Electrical & ElectronicEngineering, Mechanical

Scopus Categories

Computer Science ApplicationsMechanics of MaterialsElectrical and Electronic EngineeringElectronic, Optical and Magnetic Materials

Research Topics (OpenAlex)

Electronic Packaging and Soldering TechnologiesHeat Transfer and Optimization3D IC and TSV technologiesHeat Transfer and Boiling StudiesHeat Transfer MechanismsAdhesion, Friction, and Surface InteractionsMechanical Behavior of CompositesThermal properties of materialsSilicon Carbide Semiconductor TechnologiesMetal Forming Simulation Techniques

Frequently asked questions about Journal of Electronic Packaging

Is Journal of Electronic Packaging a predatory journal?

PubScope has no integrity flags on record for Journal of Electronic Packaging: it is indexed in Web of Science, Scopus, and is not on DOAJ's withdrawn list. Its PubScope Trust Score is 96/100. Indexing is a transparency signal, not a guarantee — always confirm fit and policies before submitting.

What is the impact factor of Journal of Electronic Packaging?

Journal of Electronic Packaging is indexed in the Web of Science Core Collection, so Clarivate publishes an official Journal Impact Factor for it (since the 2023 Journal Citation Reports, every Core Collection journal — including Arts & Humanities and Emerging Sources titles — receives one). PubScope links to Clarivate's official source rather than reprinting the number, which can be out of date. Its open 2-year mean citedness is 1.59.

Is Journal of Electronic Packaging indexed in Scopus and Web of Science?

Journal of Electronic Packaging is indexed in Web of Science, Scopus.