The Journal of Electronic Packaging focuses on the thermal management of electronic devices and systems, including advanced cooling techniques such as two-phase cooling, jet impingement, and immersion cooling. It also covers electronic packaging technologies, reliability, and manufacturing processes, with an emphasis on heterogeneous integration, solder joint reliability, and warpage mitigation. The journal addresses challenges in high-power computing, data centers, and AI hardware.
Computer Science ApplicationsMechanics of MaterialsElectrical and Electronic EngineeringElectronic, Optical and Magnetic Materials
Research Topics (OpenAlex)
Electronic Packaging and Soldering TechnologiesHeat Transfer and Optimization3D IC and TSV technologiesHeat Transfer and Boiling StudiesHeat Transfer MechanismsAdhesion, Friction, and Surface InteractionsMechanical Behavior of CompositesThermal properties of materialsSilicon Carbide Semiconductor TechnologiesMetal Forming Simulation Techniques