Home›Search›Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging
IMAPS-International Microelectronics and Packaging Society · United States · Est. 1996
ISSN1551-4897
SJR Q4✓ Scopus / SJR
5
/ 100
High Risk
Score Breakdown
✓ Scopus Q4+5
Total5
Journal Impact Factor
Not on record at PubScope. The Journal Impact Factor is published by Clarivate for Web of Science (JCR)–indexed journals.
SJR Score
0.157
H-Index
22
SNIP
0.486
Total Works
521
Total Citations
2,562
2yr Mean Citedness
0.89
Free JIF alternative
Aims & Scope✦ Inferred from recent articles
This journal focuses on the fabrication, materials, and reliability of microelectronic components and their packaging. It covers topics such as advanced interconnect technologies, including copper-to-copper bonding and wire bonding, and the development of novel materials and processes for miniaturized and high-density electronic systems. The scope also includes thermal management solutions, additive manufacturing techniques for electronic components, and simulation methods for predicting package performance and reliability.
AI-summarised from recent articles · verify on the publisher page
⚡ Speed vs Prestige
How does this journal balance review speed with impact level?
IMAPS-International Microelectronics and Packaging Society
❌
Does the journal have a website?
No URL
✅
Is the ISSN verified?
1551-4897
✅
Indexed in a trusted database?
Scopus
❌
Peer review process documented?
N/A
❌
Follows ethical publishing standards (COPE)?
N/A
❌
APC fees clearly disclosed?
N/A
✅
Not on predatory/blacklists?
✓ Clean
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Long-term digital preservation?
N/A
❌
Plagiarism detection in place?
N/A
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Listed in DOAJ (verified OA)?
N/A
❌
Primary language documented?
N/A
Based on the Think.Check.Submit framework by DOAJ, COPE & OASPA. All data from verified open sources.
Publication & Citation Trend
Articles published
Times cited
2019
2020
2021
2022
2023
2024
2025
2026
Source: OpenAlex · Note: citations accumulate over time so older years appear higher
SJR Quartile by Discipline
Scimago ranks this journal separately in each subject category — its quartile can differ by discipline.
Computer Networks and CommunicationsQ4
Electrical and Electronic EngineeringQ4
Electronic, Optical and Magnetic MaterialsQ4
Subject Classification
Scopus Categories
Computer Networks and CommunicationsElectrical and Electronic EngineeringElectronic, Optical and Magnetic Materials
Research Topics (OpenAlex)
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrical and Thermal Properties of MaterialsElectromagnetic Compatibility and Noise SuppressionSilicon Carbide Semiconductor TechnologiesFerroelectric and Piezoelectric MaterialsAdditive Manufacturing and 3D Printing TechnologiesHeat Transfer and OptimizationIntegrated Circuits and Semiconductor Failure AnalysisSemiconductor Lasers and Optical Devices