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Journal of Microelectronics and Electronic Packaging

IMAPS-International Microelectronics and Packaging Society · United States · Est. 1996

ISSN1551-4897

SJR Q3✓ Scopus / SJR

Journal Impact Factor

Not on record at PubScope. The Journal Impact Factor is published by Clarivate for Web of Science (JCR)–indexed journals.

📊 Standing in its field

Where this journal ranks among others in the same subject area.

SJR · Scopus

Top 75% in field

Clarivate’s JCR quartile is a separate ranking and may differ

SJR Scorei

0.235

H-Indexi

SNIPi

0.486

Total Worksi

521

Total Citationsi

2,562

2yr Mean Citednessi

0.89

Open Impact Factor alternative

Aims & Scope

Subject areas: Computer Networks and Communications; Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials.

General Information

Country / RegionUnited States

Primary Language—

1st Year Published1996

Annual Volume~ 13 articles / year

StatusActive (last: 2025)

Total Publications521

OA Since2018

Submission Info

Peer Review—

OA License—

OA Rate—

Ethics & Quality

COPE Member✗ No

OASPA Member✗ No

Not on Predatory Lists✓ Yes

Think.Check.Submit Compliance

thinkchecksubmit.org

4/11 · 36%

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Do you know the journal / publisher?

IMAPS-International Microelectronics and Packaging Society

❌

Does the journal have a website?

No URL

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Is the ISSN verified?

1551-4897

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Indexed in a trusted database?

Scopus

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Peer review process documented?

N/A

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Follows ethical publishing standards (COPE)?

N/A

✅

Not on predatory/blacklists?

✓ Clean

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Long-term digital preservation?

N/A

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Plagiarism detection in place?

N/A

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Listed in DOAJ (verified OA)?

N/A

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Primary language documented?

N/A

A twelfth criterion — whether APC fees are clearly disclosed — is not scored here; it is left out of the total rather than counted as a failure. Publication charges appear in the metrics card above.

Based on the Think.Check.Submit framework by DOAJ, COPE & OASPA. All data from verified open sources.

Publication & Citation Trend

Articles published

Citations received

141

2019

2020

2021

2022

2023

2024

2025

2026

Source: OpenAlex · Each year’s green bar = citations earned by that year’s papers, counted to date — so recent years look lower simply because their papers haven’t had time to be cited yet.

SJR Quartile by Discipline

Scimago ranks this journal separately in each subject category — its quartile can differ by discipline.

Computer Networks and CommunicationsQ3

Electrical and Electronic EngineeringQ3

Electronic, Optical and Magnetic MaterialsQ4

Subject Classification

Scopus Categories

Computer Networks and CommunicationsElectrical and Electronic EngineeringElectronic, Optical and Magnetic Materials

Research Topics (OpenAlex)

Electronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrical and Thermal Properties of MaterialsElectromagnetic Compatibility and Noise SuppressionSilicon Carbide Semiconductor TechnologiesFerroelectric and Piezoelectric MaterialsAdditive Manufacturing and 3D Printing TechnologiesHeat Transfer and OptimizationIntegrated Circuits and Semiconductor Failure AnalysisSemiconductor Lasers and Optical Devices

Frequently asked questions about Journal of Microelectronics and Electronic Packaging

Is Journal of Microelectronics and Electronic Packaging a predatory journal?

PubScope has no integrity flags on record for Journal of Microelectronics and Electronic Packaging: it is indexed in Scopus, and is not on DOAJ's withdrawn list. Indexing is a transparency signal, not a guarantee — always confirm fit and policies before submitting.

What is the impact factor of Journal of Microelectronics and Electronic Packaging?

Journal of Microelectronics and Electronic Packaging is not in the Web of Science Core Collection, so it has no official Clarivate Journal Impact Factor. Its SCImago SJR score is 0.235.

Is Journal of Microelectronics and Electronic Packaging indexed in Scopus and Web of Science?

Journal of Microelectronics and Electronic Packaging is indexed in Scopus.

What is the aims and scope of Journal of Microelectronics and Electronic Packaging?