The journal focuses on advanced manufacturing and packaging technologies for electronic components and systems. This includes novel deposition methods for solder paste, additive manufacturing of antennas and interconnects, and techniques for improving the performance and reliability of radio frequency (RF) and millimeter-wave (mm-wave) devices. Research also covers defect detection and repair in printed circuit boards, micro-LED integration, and methods to mitigate wafer warpage in 3D NAND technology.
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Q1
SJR Rank
Top 25% in field
General Information
Country / RegionUnited States
Primary LanguageEnglish
1st Year Published1988
FrequencyBimonthly
StatusActive (last: 2026)
Total Publications5,072
Publisher OrgInstitute of Electrical and Electronics Engineers
Industrial and Manufacturing EngineeringElectrical and Electronic EngineeringElectronic, Optical and Magnetic Materials
Research Topics (OpenAlex)
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesMicrowave Engineering and WaveguidesElectromagnetic Compatibility and Noise SuppressionAdvanced Antenna and Metasurface TechnologiesHeat Transfer and OptimizationSilicon Carbide Semiconductor TechnologiesRadio Frequency Integrated Circuit DesignAntenna Design and AnalysisFerroelectric and Negative Capacitance Devices