Home›Search›Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
IEEE Computer Society · United States
ISSN2150-5942
SJR -✓ Scopus / SJR
0
/ 100
High Risk
Score Breakdown
No verified metricsTotal0
Journal Impact Factor
Not on record at PubScope. The Journal Impact Factor is published by Clarivate for Web of Science (JCR)–indexed journals.
SJR Score
0.19
H-Index
13
SNIP
0.373
⚡ Speed vs Prestige
How does this journal balance review speed with impact level?
-
SJR Rank
Bottom 25%
General Information
Country / RegionUnited States
Primary Language—
1st Year Published—
StatusActive
Total Publications—
Submission Info
Peer Review—
Review Time—
Acceptance Rate—
OA License—
OA Rate—
Ethics & Quality
COPE Member✗ No
OASPA Member✗ No
Not on Predatory Lists✓ Yes
Think.Check.Submit Compliance
4/12 · 33%
✅
Do you know the journal / publisher?
❌
Does the journal have a website?
✅
Is the ISSN verified?
✅
Indexed in a trusted database?
❌
Peer review process documented?
❌
Follows ethical publishing standards (COPE)?
❌
APC fees clearly disclosed?
✅
Not on predatory/blacklists?
❌
Long-term digital preservation?
❌
Plagiarism detection in place?
❌
Listed in DOAJ (verified OA)?
❌
Primary language documented?
Based on the Think.Check.Submit framework by DOAJ, COPE & OASPA. All data from verified open sources.
SJR Quartile by Discipline
Scimago ranks this journal separately in each subject category — its quartile can differ by discipline.
Control and Systems EngineeringUnranked
Electrical and Electronic EngineeringUnranked
Hardware and ArchitectureUnranked
Subject Classification
Scopus Categories
Hardware and ArchitectureElectrical and Electronic EngineeringControl and Systems Engineering
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Data updated: 2026-05-22 · Sources: SJR, DOAJ, OpenAlex, WoS, Crossref